I've read two variations on a single suggestion that appear to minimize risk of overheating the component and that purport to avoid a cold joint. My understanding follows, but I'm not sure I've got it right: apply the tip of the iron to about 1mm to 2mm of solder between the tip and the junction of the lead and trace; and as the solder instantly melts apply the iron tip to the junction of lead and trace and the tip of the solder to the junction of the lead, trace and instantly melted solder (not to the tip of the solder wire) and melt the amount of solder you need.
Am I understanding this right and do you recommend this technique? Does it avoid fried components?
Thanks again, Jeff
Am I understanding this right and do you recommend this technique? Does it avoid fried components?
Thanks again, Jeff